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PM congratulates Indians at foundation laying ceremony of 3 chip plants

Published:

Prime Minister

Narendra Modi

today virtually laid the foundation stone of three

semiconductor projects

worth Rs 1.25 lakh crore. These projects have taken just 15 days to kick-off after the Union Cabinet’s approval last month. In February, the Union Cabinet chaired by Prime Minister Modi approved the establishment of three more semiconductor units under programme ‘Development of Semiconductors and Display Manufacturing Ecosystems’ in India. The programme for ‘Development of Semiconductors and Display Manufacturing Ecosystem’ in India was notified on December 21, 2021, with a total outlay of Rs 76,000 crore.
PM Modi: India rewriting history
Addressing the gathering, especially thousands of students from across the country at ‘India’s Techade: Chips for Viksit Bharat’ programme, PM Modi said that today, we are not only rewriting history but also taking a big leap towards a bright future. “This historic day will help India become a global semiconductor hub. I congratulate all the citizens on this momentous occasion. More than 60,000 colleges, universities and institutions are virtually part of this programme,” PM Modi told the audience.
“The 21st century can’t be thought of without high-end chips and India will play a crucial role in providing semiconductors across the spectrum in the Industry 4.0 revolution,” the Prime Minister added.

In line with the Prime Minister’s vision, the foundation stone was laid for the semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; the Outsourced Semiconductor Assembly and Test (OSAT) facility at Morigaon, Assam; and the Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat.
Union Communications and IT Minister

Ashwini Vaishnaw

said that this momentous moment has been made possible under the decisive and visionary leadership of PM Modi.

“Since 1962, the planning to manufacture semiconductors has been going on in the country but to no avail. Now, within a year, we have seen ground-breaking ceremonies of four semiconductor plants (including the Micron plant in Sanand, Gujarat in September last year). This was only possible with PM Modi’s ‘Atmanirbhar Bharat’ mission,” said the IT Minister.
Tata Group to set up India’s first commercial semiconductor fab
Of the three new chip plants, two are being set up in Gujarat and one in Assam. Tata Group is setting up two of these three plants. * Tata Electronics Private Limited (“TEPL”) will set up a semiconductor fab in partnership with Powerchip Semiconductor Manufacturing Corp (PSMC), Taiwan, in Dholera, Gujarat. Investment in this fab will be Rs 91,000 crore. PSMC has 6 semiconductor foundries in Taiwan. The capacity of the Dholera unit will be 50,000 wafer starts per month (WSPM).
* CG Power, in partnership with Renesas Electronics Corporation, Japan and Stars Microelectronics, Thailand will set up a semiconductor unit in Sanand, Gujarat. This unit will be set up with an investment of Rs 7,600 crore. The CG power semiconductor unit will manufacture chips for consumer, industrial, automotive and power applications.
* Tata Semiconductor Assembly and Test Pvt Ltd (“TSAT”) will set up a semiconductor unit in Morigaon, Assam. With a capacity of producing 48 million chips per day, this facility is being built at a cost of Rs 27,000 crore. Segments that will be covered are automotive, electric vehicles, consumer electronics, telecom, and mobile phones.
To generate 80,000 jobs
These units are expected to generate direct employment of 20 thousand advanced technology jobs and about 60 thousand indirect jobs. These units will accelerate employment creation in downstream automotive, electronics manufacturing, telecom manufacturing, industrial manufacturing, and other semiconductor-consuming industries.

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